FLUX-CHIP is a program based on the Finite Element Method for the computation of electrical and thermal interactions inside electronic components. The behavior of electronic components is dependent on the effects of the electrical and thermal interactions. The association of chips and their location in the component are optimized using FLUX-CHIP.
FLUX-CHIP features the coupling of a thermal finite element solver and circuit equations. It computes the electrical and thermal imbalances between chips. These imbalances are the result of the intrinsic electrical characteristics of each chip and their variation. These characteristics change with the temperature, which is produced by the conduction and commutation losses. FLUX-CHIP also features the computation of noncoupled thermal problems.
Fields of Use:
FLUX-CHIP is integrated with the environment of Flux3D, and shares both the pre- and post-processor with Flux3D. FLUX-CHIP benefits from this environment that has made Flux3D a widely used tool in the domain of electromagnetic modelling. FLUX-CHIP includes the different steps of modelling, geometric and physical pre-processing, mesh generation, solving and post-processing, all in one program.
The pre-processor features all the necessary tools to quickly create and modify three dimensional geometries:
FLUX-CHIP features an extrusive mesh generator. It is well adapted for the meshing of the layered structure in electronic components (examples: piling of chips, radiator, insulator, sockets). It meshes volumes with prisms by extruding the triangular mesh on the faces. For more specific needs, FLUX-CHIP also features the automatic mesh generator of Flux3D. This mesh generator subdivides geometry into tetrahedrons.
The chips are described, in their passing state, by the V(I) curve. A chip's threshold voltage and on-state resistance depend on its average temperature. The conduction losses (static) and the commutation losses (dynamic) are evaluated according to the average temperature of the chip, the cut-in voltage and current, the frequency, the angle of conduction, and the manufacturers data on the commutation time.
The thermal properties of each component includes its thermal conductivity, linear or nonlinear. The boundary conditions are set temperatures, convection, or radiation. The convection and radiation coefficients can depend on the temperature.
The chips can be associated in parallel within the same circuit. The description and handling of any type of circuit, series or parallel, is under development.
Simplified organization chart of the solver:
FLUX-CHIP was developed by Laboratoire d'Electrotechnique de Grenoble (LEG) and was validated by designing components for SGS-THOMSON, GEC-Alsthom, and Schneider-Electrique.
If you would like more information about Flux-CHIP please contact Philippe Wendling at Magsoft.
